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IC Package Mechanical FEA Engineer (R&D)
Develop and optimize multi-chip-module packages for advanced ASIC applications.
Fort Collins, Colorado, United StatesSan Jose, California, United States
Expert
2 months ago
✨ About The Role
- The role involves designing mechanical aspects of ASIC packages for high-performance applications in AI, networking, and HPC.
- Responsibilities include using advanced FEA to optimize reliability and manufacturing processes for complex packages.
- The engineer will be expected to manage multiple projects simultaneously, ensuring timely delivery and prioritization of tasks.
- The position offers opportunities to work with emerging package integration technologies, enhancing the candidate's expertise in the field.
- The engineer will document design rules and guidelines to standardize processes and improve efficiency.
âš¡ Requirements
- The ideal candidate will have a strong background in mechanical engineering, particularly in the field of finite element analysis (FEA) modeling.
- A minimum of 8 years of experience in FEA modeling is required, with advanced degrees preferred for those with less experience.
- The successful candidate will possess the ability to evaluate complex numerical simulation results and calibrate modeling with empirical data.
- Experience in collaborating with cross-functional teams, including package designers and manufacturing partners, is essential.
- Strong presentation skills are necessary to effectively communicate findings to various audiences, including engineers and senior management.
IC Package Mechanical FEA Engineer (R&D)
Fort Collins, Colorado, United States
Engineering
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