✨ About The Role
- The role involves designing and implementing physical layouts for power grids and interconnects in advanced IC products.
- Responsibilities include conducting DRC, LVS, and electrical checks to ensure design integrity.
- The candidate will collaborate with SI and PI engineers to develop high-speed signal interconnects.
- The position requires evaluating and developing new interconnect technologies for MCM, 2.5D, and 3D ICs.
- The job also involves technology roadmapping and working closely with R&D, IP development, and manufacturing partners.
âš¡ Requirements
- The ideal candidate will have a strong background in electrical engineering or computer science, with a bachelor's or master's degree.
- A minimum of 6-8 years of relevant work experience is required, demonstrating expertise in physical layout and design.
- The candidate should be an independent, self-starter capable of managing multiple projects and customers simultaneously.
- Proficiency in scripting languages such as TCL and Python is essential for automating design processes.
- A strong interest in advanced packaging technologies, particularly 2.5D and 3D IC development, is crucial for success in this role.