✨ About The Role
- The role involves working closely with marketing and IC design teams to select optimal packaging solutions for advanced silicon node products.
- The candidate will be responsible for ensuring that designed packages meet stringent thermal and performance requirements.
- Research and development of new materials to support advanced node silicon will be a key responsibility.
- The position requires managing IC packaging activities from concept through to high volume production.
- The candidate will interface with external customers for custom ASIC programs and support NPI bring-up and qualification.
âš¡ Requirements
- The ideal candidate will have a strong educational background in STEM fields, particularly in Material Science, Electrical, or Mechanical Engineering.
- A minimum of 8 years of relevant experience is required, with a preference for candidates holding a PhD and 3 years of experience.
- The candidate should possess deep knowledge of signal integrity and power integrity concepts, demonstrating expertise in advanced silicon node products.
- Strong project management and leadership skills are essential for managing IC packaging activities and interfacing with various teams.
- The successful candidate will have hands-on experience with advanced assembly processes and a solid understanding of materials related to Chip Packaging Interaction.